amd
![Brian Piercy](data:image/svg+xml;utf8,<svg xmlns="http://www.w3.org/2000/svg" viewBox="0 0 24 24" fill="%230A66C2"><path d="M20.447 20.452H16.89v-5.569c0-1.328-.027-3.037-1.852-3.037-1.853 0-2.136 1.445-2.136 2.939v5.667H9.351V9h3.414v1.561h.046c.477-.9 1.637-1.85 3.37-1.85 3.601 0 4.267 2.37 4.267 5.455v6.286zM5.337 7.433a1.982 1.982 0 1 1 0-3.964 1.982 1.982 0 0 1 0 3.964zm1.782 13.019H3.555V9h3.564v11.452zM22.225 0H1.771C.792 0 0 .774 0 1.729v20.542C0 23.227.792 24 1.771 24h20.451C23.2 24 24 23.227 24 22.271V1.729C24 .774 23.2 0 22.222 0h.003z"/></svg>)
Examining RDNA 4's out-of-order memory accesses in detail, and investigating with testing
Lenovo, the firm emerging as a driving force behind AI computing, has expressed tremendous optimism about AMD's Instinct MI300X accelerator.
While there have been efforts by AMD over the years to make it easier to port codebases targeting NVIDIA's CUDA API to run atop HIP/ROCm, it still requires work on the part of developers.
AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
AMD is one of the oldest designers of large scale microprocessors and has been the subject of polarizing debate among technology enthusiasts for nearly 50 years. Its...
AMD ROCm documentation