cover image

Lace, a Norway-headquartered chipmaking equipment startup which is backed by Microsoft, has raised $40 million in funding to ‌further develop a technology that could enable significant advances in semiconductor design and manufacturing, the company said on Monday.

cover image

Modeling, simulation, and digital twins enable EUV innovation.

cover image

The discussion of any particular lithographic application often refers to…

cover image

Faster masks, less power.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

cover image

TSMC is moving to production with the NVIDIA cuLitho computational lithography platform to accelerate manufacturing of advanced semiconductor chips.