thermal
![Brian Piercy](data:image/svg+xml;utf8,<svg xmlns="http://www.w3.org/2000/svg" viewBox="0 0 24 24" fill="%230A66C2"><path d="M20.447 20.452H16.89v-5.569c0-1.328-.027-3.037-1.852-3.037-1.853 0-2.136 1.445-2.136 2.939v5.667H9.351V9h3.414v1.561h.046c.477-.9 1.637-1.85 3.37-1.85 3.601 0 4.267 2.37 4.267 5.455v6.286zM5.337 7.433a1.982 1.982 0 1 1 0-3.964 1.982 1.982 0 0 1 0 3.964zm1.782 13.019H3.555V9h3.564v11.452zM22.225 0H1.771C.792 0 0 .774 0 1.729v20.542C0 23.227.792 24 1.771 24h20.451C23.2 24 24 23.227 24 22.271V1.729C24 .774 23.2 0 22.222 0h.003z"/></svg>)
Interconnect efficiency is now essential and photonics can help
As data centers move toward Earth's orbit, thermal management becomes a major challenge, forcing engineers to rethink system design in space.
Thin films for insulating different components are causing dissipation issues in advanced chips.
Air cooling holdouts take notice, the fun stuff is all liquid
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.