With all of this talk about datacenters in space, and the pushback along the lines of thermal control, it is worth reviewing what the physics says. Objects in space primarily lose heat through radiative heat loss, also known as Stefan-Boltzmann radiation. This is governed by the…
Two general principles to help understand and defeat overheating
d-Matrix is tackling the 3D DRAM heat problem by stacking memory beneath the XPU, but atomic-level flatness remains a brutal barrier.
As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.
Interconnect efficiency is now essential and photonics can help
As data centers move toward Earth's orbit, thermal management becomes a major challenge, forcing engineers to rethink system design in space.
Thin films for insulating different components are causing dissipation issues in advanced chips.
Air cooling holdouts take notice, the fun stuff is all liquid
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.