d-Matrix is tackling the 3D DRAM heat problem by stacking memory beneath the XPU, but atomic-level flatness remains a brutal barrier.
let's talk more technical details about AMD's Helios! Anthropic just signed a $5B deal with AMD. and AMD's own version of GTC, Advancing AI, is happening today and tomorrow. the high level details are: 72 MI455X GPUs, 432GB of HBM4 each, and 2.9 exaflops of FP4. but the most…
Examining RDNA 4's out-of-order memory accesses in detail, and investigating with testing
Lenovo, the firm emerging as a driving force behind AI computing, has expressed tremendous optimism about AMD's Instinct MI300X accelerator.
While there have been efforts by AMD over the years to make it easier to port codebases targeting NVIDIA's CUDA API to run atop HIP/ROCm, it still requires work on the part of developers.
AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
AMD is one of the oldest designers of large scale microprocessors and has been the subject of polarizing debate among technology enthusiasts for nearly 50 years. Its...
AMD ROCm documentation