BLOOMINGTON, Minn. and SAN JOSE, Calif. – April 6, 2021 – SkyWater Technology, the trusted technology realization partner, and Efabless, a crowdsourcing design platform for custom silicon, today announced the first tapeout in a series of Google-sponsored open source…
What makes a GPU a GPU, and when did we start calling it that? Turns out that’s a more complicated question than it sounds.
Technically legal, but strange.
How much should one pay for a chip or a component? Lytica, a Canadian supply-chain pricing analytics company, has the answer. Founded by former Nortel chief procurement officer Ken Bradley, who, like many others in the IT industry, was once bemused by component pricing, Lytica…
The “Milan” Epyc 7003 processors, the third generation of AMD’s revitalized server CPUs, is now in the field, and we await the entry of the “Ice Lake”
AMD is one of the oldest designers of large scale microprocessors and has been the subject of polarizing debate among technology enthusiasts for nearly 50 years. Its...
SRAM cell architecture introduction: design and process challenges assessment.
One of the main tenets of the hyperscalers and cloud builders is that they buy what they can and they only build what they must. And if they are building
over 7,000 wafers stacked (from STDF data)
AMD ROCm documentation
With every passing year, as AMD first talked about its plans to re-enter the server processor arena and give Intel some real, much needed, and very direct
Here's what we've learnt about networks and the routers that interconnect them in the last 50 years.
We have a bad case of the silicon shakes and a worsening deficiency in iron here at The Next Platform, but the good news is that new CPU processors from
The breakthrough is taking full advantage of the orbital angular momentum properties of a coherent light source, thus enabling multiplexing.
Despite high development costs, smaller nodes bring greater revenue per wafer.
IC Insights recently released its new Global Wafer Capacity 2021-2025 report that provides details, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2025. Rankings of IC manufacturers by installed capacity for…
The inception of Google’s effort to build its own AI chips is quite well known by now but in the interests of review, we’ll note that as early 2013 the
The hardware shortages currently hitting most of the PC market may be caused by a shortage in a necessary component in chip manufacturing, not low yields on TSMC's 7nm node.
How Compute Express Link provides a means of connecting a wide range of heterogeneous computing elements.
Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper…
Flexible Tape-and-Reel Circuit Substrate, High-end FPC, tape-and-reel, FPC, COF film, tape, single-piece packaging, Circuit Substrate,COF tape, tape film, substrate
Understanding Intel® processor names and numbers helps identify the best laptop, desktop, or mobile device CPU for your computing needs.
Clock Gating is defined as: “Clock gating is a technique/methodology to turn off the clock to certain parts of the digital design when not needed”. The Need for Clock Gating With most of the SoCs heavily constrained by power budgets, it is of utmost importance to reduce power…
Leakage current can contribute to power dissipation, especially at lower threshold voltages. Learn about six types of leakage current that can be found in MOS transistors.
In this series of articles, we’ll explore higher-output-current alternatives to photodiodes.
Gate-all-around FETs will replace finFETs, but the transition will be costly and difficult.
Intel is in much more danger than its profits suggest; the problems are a long time in the making, and the solution is to split up the company.
How can you calculate the number of dies per wafer? A free online tool, DPW equation and reference to two other DPW calculators. Trusted by Amkor and GF.
Static Timing Analysis? Read here the best overview to STA, including theory, real examples, ilustrations, tips and tricks.
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).
DIE YIELD CALCULATOR Use this online calculator to figure out die yield using Murphy’s model. You’ll need to know the die size, wafer diameter, and defect density. iSine is your complete resource for ASIC design – from concept to manufacturing and testing. We have expertise in…
Long-time Slashdot reader UnknowingFool writes: AMD filed a patent on using chiplets for a GPU with hints on why it has waited this long to extend their CPU strategy to GPUs. The latency between chiplets poses more of a performance problem for GPUs, and AMD is attempting to…
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.
Intel has been talking about on-processor FPGAs since 2014, but AMD's patent might actually result in one.
Research on 2D transistors for future electronics is forging ahead with different material favorites
Engineers must keep pace with advanced IC packaging technology as it evolves rapidly, starting with understanding the basic terms.
In the last part of our series, we went over the thin-film process in which a semiconductor chip gets its electrical properties. But we need to ensure that
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.
How Mythic got its optimized domain-specific core without compromises or delays.
With 5G rolling out more quickly as we approach 2021, it may be helpful to touch on the key technologies that make 5G such a speedy success.
In this article, we will learn how to find the optimal size of a transistor/logic gate present in a larger circuit to provide the desired performance using the linear delay model.
This is a list of semiconductor fabrication plants. A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are manufactured. They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and…
Learn the high-level steps behind RFIC design.
As implementations evolve to stay relevant, a new technology threatens to overtake SerDes.