Why Intel Lost Its CPU Crown To AMD (And How Ryzen Changed The Game) - SlashGear
Intel was a dominant leader in the CPU market for the better part of a decade, but AMD has seen massive success in recent years thanks to its Ryzen chips.
semiconductors
Intel Arc B580 "Battlemage" GPU Leak Confirms 12 GB Memory, Custom Models With Standard Power Connectors, Up To 2.8 GHz Clocks
Intel's first Arc B580 GPUs based on the Xe2 "Battlemage" architecture have been leaked & they look quite compelling.
AI Alone Isn’t Ready for Chip Design
A combination of classical search and machine learning may be the way forward
New Ultrafast Memory Boosts Intel Data Center Chips
While Intel's primary product focus is on the processors, or brains, that make computers work, system memory (that's DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory…
Amazon’s Cloud Crisis: How AWS Will Lose The Future Of Computing
Nitro, Graviton, EFA, Inferentia, Trainium, Nvidia Cloud, Microsoft Azure, Google Cloud, Oracle Cloud, Handicapping Infrastructure, AI As A Service, Enterprise Automation, Meta, Coreweave, TCO
One Laser To Pump Up AI Interconnect Bandwidth By 10X
According to rumors, Nvidia is not expected to deliver optical interconnects for its GPU memory-lashing NVLink protocol until the “Rubin Ultra” GPU
Graphene-Based Memristors Inch Towards Practical Production - Slashdot
Longtime Slashdot reader Baron_Yam writes: Memristors are the long-sought 4th fundamental circuit element. They promise analog computing capability in hardware, the ability to hold state without power, and to work with less power. A small cluster of them can replace a transistor…
Gate-All-Around (GAA): The Ultimate Solution to Reduce Leakage - EE Times
As awareness of environmental, social, and governance (ESG) issues grows, companies are adopting strategies for sustainable operations.
New Approach to Encoding Optical Weights for In-Memory Photonic Computing Using Magneto-Optic Memory Cells
A new technical paper titled “Integrated non-reciprocal magneto-optics with ultra-high endurance for photonic in-memory computing” was published by researchers at UC Santa Barbara, University of Cagliari, University of Pittsburgh, AIST and Tokyo Institute of Technology. Abstract…
Google's Tensor G6 Chip Will Be Built on TSMC's 2nm Architecture For Major Performance and Efficiency Gains, Codenamed Malibu
Google Poxel 11s Tensor G6 codename leaks along with the Tensor G5 chip, expected to be built on TSMC's 2nm manufacturing process.
Mini Review of Photodetectors and Image Sensors: Materials and Fabrication
A new technical paper titled “Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed Semiconductors” was published by researchers at Cardiff University. Abstract “This mini-review explores the evolution of image sensors, essential electronic components…
Wide-Bandgap Semiconductors Shape Next-Gen SDVs
WBG semiconductors promise to transform the automotive industry, elevating vehicle performance and sustainability to unprecedented levels.
One Laser To Pump Up AI Interconnect Bandwidth By 10X
According to rumors, Nvidia is not expected to deliver optical interconnects for its GPU memory-lashing NVLink protocol until the “Rubin Ultra” GPU
Introduction to the Class C Power Amplifier
This article examines the operation of the Class C power amplifier and how it compares to its Class A and Class B counterparts.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in in white zone
China has big plans for semiconductor industry and they include self reliance.
Understanding Two Port Amplifier Power Gains
Transducer, Unilateral, Available and Power Gain; what they mean and how to calculate them.
ABCs of Power Amplifier Classes: Foundations
Basic concepts required to understand classes of operation in power amplifiers.
Intel Vs. Samsung Vs. TSMC
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
Zen 5’s 2-Ahead Branch Predictor Unit: How a 30 Year Old Idea Allows for Ne
When I recently interviewed Mike Clark, he told me, “…you’ll see the actual foundational lift play out in the future on Zen 6, even though it was really Zen 5 that set the table for that.” And at that same Zen 5 architecture event, AMD’s Chief Technology Officer Mark Papermaster…
The Future of Semiconductor Freight
Transporting Tools Isn’t Easy
Poor Thermal Paste Quality Pointed Out As Culprit Behind Rising GPU Tempera
Poor quality thermal paste might be the reason your GPU is running hotter than usual after a certain period of time.
Tenstorrent Launches Wormhole AI Processors: 466 FP8 TFLOPS at 300W
AMD Plans to Use Glass Substrates in its 2025/2026 Lineup of High-Performan
AMD reportedly plans to incorporate glass substrates into its high-performance system-in-packages (SiPs) sometimes between 2025 and 2026. Glass substrates offer several advantages over traditional organic substrates, including superior flatness, thermal properties, and…
JEDEC Finalizes HBM4 Spec With A Key Upgrade For Memory Manufacturers
HBM4 is going to double the bandwidth of HBM3, but not through the usual increase in clock rate.
Applied Materials' New Deposition Tool Enables Copper Wires to Be Used for
Unleashing the Potential of Alternative Deep Learning Hardware
To address the limitations of GPUs for AI, engineers are exploring general-purpose hardware, dedicated DL hardware and neuromorphic hardware.
Standard cells: Looking at individual gates in the Pentium processor
Intel released the powerful Pentium processor in 1993, a chip to "separate the really power-hungry folks from ordinary mortals." The origin...
Beyond GPUs: Innatera and the quiet uprising in AI hardware
The brain-inspired architecture gives neuromorphic systems distinct advantages, particularly for edge computing applications in consumer devices and industrial IoT.
Fabricated Knowledge Q2 2024 Quarterly Review
Here's everything that happened this quarter, and some thoughts and ideas.
Meet Sohu: The World’s First Transformer Specialized Chip ASIC
The Sohu AI chip by Etched is a thundering breakthrough, boasting the title of the fastest AI chip to date. Its design is a testament to cutting-edge innovation, aiming to redefine the possibilities within AI computations and applications. At the center of Sohu's exceptional…
Qorvo Introduces Alternative to Mechanical Circuit Breakers
Qorvo's 4 mΩ SiC JFET for solid-state circuit breakers provides significant advantages over traditional mechanical breakers. Andy Wilson discussed the details with EEPower at PCIM 2024.
Intel’s Latest FinFET Is Key to Its Foundry Plans
Company’s new process signals transition toward foundry service provider
Controlling Warpage In Advanced Packages
Mechanical stresses increase with larger sizes and heterogeneous materials.
Single Vs. Multi-Patterning Advancements For EUV
EUV patterning has come a long way in the past five years, but old challenges resurface with high-NA EUV.
About Nantian Electronics : IC chips & IGBT modules Disctributor
Nantian Electronics Co Limited provide complete and cost effective sourcing solution to OEMs, CEMs, distributors, the needs of manufacturers and other companies.
ST remains largest silicon carbide power device maker, with 32.6% market sh
onsemi rises from fourth to second; top five players comprise 91.9% of revenue
US chipmaker Onsemi to invest $2bn in Czech Republic silicon carbide facili
Largest one-off direct foreign investment in the country
DRAM: an industry in full flight
Generative AI and High Bandwidth Memory (HBM) fuel DRAM market growth. OUTLINE The HBM market has the potential to grow to US$14 billion in 2024. Yole Group expects HBM revenue growth to continue with a CAGR23-29 of ~38%, reaching about US$37.7 billion in 2029. 4F2 cell designs…
Flow claims it can 100x any CPU’s power with its companion chip and some el
A Finnish startup called Flow Computing is making one of the wildest claims ever heard in silicon engineering: by adding its proprietary companion chip,
Fan-Out Panel-Level Packaging (FO-PLP): Ultimate Guide
In this guide, we’ll elucidate the pivotal role of FO-PLP in advancing the semiconductor sector. Harnessing cost-effectiveness with enhanced functionality, FO-PLP beckons a new era of electronic sophistication. Let’s delve into the ultimate guide to Fan-Out Panel-Level Packaging…
Record fab capacity in 2025 with 17 new fabs
The semiconductor industry is set to see a record fab capacity with 17 new lines in 2025 according to Knometa Research.
How Japanese Companies Are Benefiting From the Chips Battle
With subsidies and a $6 billion acquisition, Tokyo wants to make its companies indispensable in the global supply chain.
TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense
Hybrid Bonding Plays Starring Role in 3D Chips
Tech makes millions of connections in a square millimeter of silicon
Understanding CFETs, A Next Generation Transistor Architecture
Avoiding unintended shorts and opens in a high aspect ratio etch process with very tight tolerance windows.
TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026
CMOS Image Sensor: Ultimate Guide
Imagine a world where every moment is captured with immaculate clarity, from the delicate hues of a sunset to the swift action of a sporting event. The heart of this imagery revolution lies in the CMOS image sensor (CIS), a masterpiece of technology little known outside expert…
Trillium: Google’s TPU Powerhouse Behind Its New AI Models
Google's sixth-generation tensor processing unit (TPU) stole the company's I/O developer conference stage with its higher-than-ever computing performance.
JEDEC Confirms CAMM2 Memory For Desktop PCs: DDR6 Up To 17.6 Gbps & LPDDR6
DDR6 & LPDDR6 memory will feature super-fast speeds of up to 17.6 Gbps while the CAMM2 DRAM standard is headed to desktops.
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
