A technical paper titled “Basilisk: Achieving Competitive Performance with Open EDA Tools on an Open-Source Linux-Capable RISC-V SoC” was published by researchers at ETH Zurich and University of Bologna. Abstract: “We introduce Basilisk, an optimized application-specific…
Imec’s plan to use superconductors to shrink computers
We think that waferscale computing is an interesting and even an inevitable concept for certain kinds of compute and memory. But inevitably, the work you
Wafer dicing is a critical process within the semiconductor manufacturing. It’s the step where silicon dies are separated from each other. Semiconductor wafer dicing techniques have evolved over time, from traditional blade dicing to more advanced methods such as laser and…
Demand for high-bandwidth memory is driving competition -- and prices -- higher
Funding round was led by SkyLake Equity Partners
A look at Intel's next-generation high-performance process technology, Intel 4.
How High-NA EUV can be economically viable at the 1.4nm process node
Rambus has unveiled its next-gen GDDR7 memory controller IP, featuring PAM3 Signaling, and up to 48 Gbps transfer speeds.
On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles
Datacenter GPUs and some consumer cards now exceed performance limits
Beijing will be thrilled by this nerfed silicon
GPT-4 Profitability, Cost, Inference Simulator, Parallelism Explained, Performance TCO Modeling In Large & Small Model Inference and Training
Google’s new AI chip is a rival to Nvidia, and its Arm-based CPU will compete with Microsoft and Amazon
While a lot of people focus on the floating point and integer processing architectures of various kinds of compute engines, we are spending more and more
Some of the leaders of the networking industry showed up to the Optical Fiber Conference, including Broadcom, MediaTek, Semtech, and MaxLinear.
From curvilinear designs to thermal vulnerabilities, what engineers need to know about the advantages and disadvantages of photonics.
Anton Shilov reports via Tom's Hardware: About half of the processors packaged in Russia are defective. This has prompted Baikal Electronics, a Russian processor developer, to expand the number of packaging partners in the country, according to a report in Vedomosti, a…
Lenovo, the firm emerging as a driving force behind AI computing, has expressed tremendous optimism about AMD's Instinct MI300X accelerator.
The deposits formed 380 million years ago when Africa collided with North America.
Number of 8-inch SiC fabs under construction or planned globally reaches 11
The SemiAnalysis AI accelerator model is used to gauge historical and future accelerator production by company and type.
A new technical paper titled “Functionally-Complete Boolean Logic in Real DRAM Chips: Experimental Characterization and Analysis” was published by researchers at ETH Zurich. Abstract: “Processing-using-DRAM (PuD) is an emerging paradigm that leverages the analog operational…
The Ethernet roadmap has had a few bumps and potholes in the four and a half decades since the 10M generation was first published in 1980. Remember the
What it is, and why this has become such a significant security issue.
We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.
After coming up against the limits of physics, scientists are rethinking chip architecture like never before
We present a predictive process design kit (PDK) for the 5 nm technology node, the ASAP5 PDK. ASAP5 is not related to a particular foundry and the ass…
Startup Groq has developed an machine learning processor that it claims blows GPUs away in large language model workloads – 10x faster than an Nvidia GPU at 10 percent of the cost, and needing a tenth of the electricity. Update: Groq model compilation time and time from access…
Faster than Nvidia? Dissecting the economics
Embracing emerging approaches is essential for crafting packages that address the evolving demands of sustainability, technology, and consumer preferences.
The discussion of any particular lithographic application often refers to…
Chafing at their dependence, Amazon, Google, Meta and Microsoft are racing to cut into Nvidia’s dominant share of the market.
In power electronics, aluminum nitride could overtake two powerhouses that only recently bested silicon
Micron’s NVDRAM chip could be a proving ground for technologies used in other products – and not become a standalone product itself. The 32Gb storage-class nonvolatile random-access memory chip design was revealed in a Micron paper at the December IEDM event, and is based on…
Understanding the unique advantages provided by silicon carbide (SiC) and gallium nitride (GaN) can help you select the optimal technology to meet your products’ power, thermal, and size requirements.
China's Countermove: How Beijing is Dodging New Semiconductor Restrictions
We're getting a first glimpses of Samsung's next-generation HBM3E and GDDR7 memory chips.
This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry standard 5nm CMOS technology node. Thermal characterization shows that for a 165K change in temperature, the Sub-threshold…
In semiconductor design, “sign-off” during the tape-out (tapeout) of a chip refers to the formal approval process to ensure that the chip design is error-free, meets all specifications, and is ready for manufacturing at the foundry. It is essential because it minimizes the risk…
Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Intel said it has made a significant breakthrough in the development of glass substrates for next-generation advanced packaging in an attempt to stay on…
Researchers also disclosed a separate bug called “Inception” for newer AMD CPUs.
Downfall attacks targets a critical weakness found in billions of modern processors used in personal and cloud computers.
TSMC is struggling with its new 3nm process, with the semiconductor giant's yield rate reportedly far below the standard expected.
AMD, Nvidia, and Intel have all diverged their GPU architectures to separately optimize for compute and graphics.
Atom-thin layers of oxygen in a chip’s silicon can make devices speedier and more reliable